In-situ Metrology for Semiconductor Manufacturing

Resistant to corrosive gases
Fast sampling, high sensitivity
Real-time actionable results

OVERVIEW

Fast, High Sensitivity Mass Spectrometers for in-situ Metrology

The ASTON platform includes a portfolio of fast, high-sensitivity mass spectrometers with proprietary software that enable quantitative, rapid gas analysis required in complex in-situ semiconductor manufacturing processes. The ASTON platform delivers real-time, chemically specific actionable insights to maximize throughput and yield. One tool can replace multiple legacy tools.

Best-in-Class Features
Parts per billion (PPB) sensitivity
Fast sample rate
Stability
Repeatability
Long sensor lifetime
Broad mass range
ASTON Advantages
Ideal for ALD/ALE and Safety
Resistant to corrosive gases and condensates
Real-time data, actionable insights
Cloud connected
No plasma required

One Tool, Many Solutions

The ASTON Platform supports the broad metrology needs, including the precise in-situ process management required in today’s industry.

The ASTON Platform solves the key in-situ metrology issues

  • Corrosive gases damage sensor
    ASTON is resistant to HCl and HF as process byproducts, NF3 for chamber cleans
  • Condensate particles coat sensor
    ASTON is resistant to TEOS & Silane byproducts used for Silicon Nitride & Oxide Deposition
  • Speed and sensitivity
    ASTON delivers best-in-class, high-speed measurements combined with PPB level sensitivity for process control

Engineered from the ground up for in-situ semiconductor metrology applications.

Dielectric Etch Endpoint
Small Open Area Dielectric Etch Endpoint (<1%)
ALD Endpoint
Metal Etch Endpoint
Chamber Management and Safety
Built specifically for semi applications
Optical Emission Spectroscopy (OES)
  • Inadequate sensitivity
  • Not quantitative
Residual Gas Analysis (RGA)
  • Inadequate sensitivity
  • Slow sampling speeds
  • Lacks robustness
Built specifically for semi applications
Dielectric Etch Endpoint
Small Open Area Dielectric Etch Endpoint
Metal EtchEndpoint
ALD Endpoint
Chamber Management and Safety
Optical Emission Spectroscopy (OES)
  • Inadequate sensitivity
  • Not quantitative
Dielectric Etch Endpoint
Small Open Area Dielectric Etch Endpoint
Metal EtchEndpoint
ALD Endpoint
Chamber Management and Safety
Residual Gas Analysis (RGA)
  • Inadequate sensitivity
  • Slow sampling speeds
  • Lacks robustness
Dielectric Etch Endpoint
Small Open Area Dielectric Etch Endpoint
Metal EtchEndpoint
ALD Endpoint
Chamber Management and Safety